Senior Integrated Photonics Packaging Engineer (RF)

Overview

Q.ANT GmbH is hiring a Senior Integrated Photonics Packaging Engineer (RF) in Stuttgart. This is a senior role focused on RF Packaging, Optoelectronic Integration, Photonic Integrated Circuits (PIC). Full responsibilities, compensation details and the application form are available on the official listing, apply directly to keep your application verified.

What you'll do

• Own day-to-day delivery as a Senior Integrated Photonics Packaging Engineer (RF), working with RF Packaging, Optoelectronic Integration, Photonic Integrated Circuits (PIC).
• Partner with engineering, product and design peers at Q.ANT GmbH to ship work that reaches real users.
• Write clear documentation and keep stakeholders updated on progress, risks and trade-offs.
• Review your own and others' work to keep quality, performance and reliability high.

Requirements

• Practical experience with RF Packaging, Optoelectronic Integration, Photonic Integrated Circuits (PIC), Signal & Power Integrity (SI/PI).
• Relevant academic or project background for a Senior Integrated Photonics Packaging Engineer (RF) role.
• Strong written and verbal communication in English.
• Comfortable working on-site in Stuttgart.

Skills